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Systems and methods for treating substrates with c

2023-08-24 来源:小奈知识网
专利内容由知识产权出版社提供

专利名称:Systems and methods for treating

substrates with cryogenic fluid mixtures

发明人:Chimaobi W. Mbanaso,Jeffery W.

Butterbaugh,David Scott Becker

申请号:US15197450申请日:20160629公开号:US10014191B2公开日:20180703

专利附图:

摘要:Disclosed herein are systems and methods for treating the surface of amicroelectronic substrate, and in particular, relate to an apparatus and method for

scanning the microelectronic substrate through a cryogenic fluid mixture used to treat anexposed surface of the microelectronic substrate. The fluid mixture may be expandedthrough a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge themicroelectronic substrate and remove particles from the microelectronic substrate'ssurface. In one embodiment, the fluid mixture may be maintained to prevent liquidformation within the fluid mixture prior to passing the fluid mixture through the nozzle.The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbondioxide, or any combination thereof.

申请人:TEL FSI, Inc.

地址:Chaska MN US

国籍:US

代理机构:Kagan Binder, PLLC

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