您的当前位置:首页正文

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES IN

2022-09-11 来源:小奈知识网
专利内容由知识产权出版社提供

专利名称:METHOD FOR FABRICATING

SEMICONDUCTOR STRUCTURES INCLUDINGTRANSISTOR CHANNELS HAVING

DIFFERENT STRAIN STATES, AND RELATEDSEMICONDUCTOR STRUCTURES

发明人:Mariam Sadaka,Bich-Yen Nguyen,Ionut Radu申请号:US14830332申请日:20150819

公开号:US20160086974A1公开日:20160324

专利附图:

摘要:Methods of fabricating a semiconductor structure include implanting ion into asecond region of a strained semiconductor layer on a multi-layer substrate to amorphizea portion of crystalline semiconductor material in the second region of the strainedsemiconductor layer without amorphizing a first region of the strained semiconductorlayer. The amorphous region is recrystallized, and elements are diffused within thesemiconductor layer to enrich a concentration of the diffused elements in a portion ofthe second region of the strained semiconductor layer and alter a strain state thereinrelative to a strain state of the first region of the strained semiconductor layer. A firstplurality of transistor channel structures are formed that each comprise a portion of thefirst region of the semiconductor layer, and a second plurality of transistor channelstructures are formed that each comprise a portion of the second region of thesemiconductor layer.

申请人:Soitec

地址:Crolles Cedex FR

国籍:FR

更多信息请下载全文后查看

因篇幅问题不能全部显示,请点此查看更多更全内容