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Power semiconductor module having a substrate and

2024-02-15 来源:小奈知识网
专利内容由知识产权出版社提供

专利名称:Power semiconductor module having a

substrate and a pressure device

发明人:Rainer Popp,Markus Gruber申请号:US12313125申请日:20081117公开号:US08203205B2公开日:20120619

专利附图:

摘要:A power semiconductor module having a substrate, a housing and a pressuredevice. The substrate further includes a body formed of an insulating material andstructured conductor tracks which are arranged thereon and have load and auxiliary

potentials. The substrate also includes recesses in the region of the structuredconductor tracks in at least two areas that are not covered by a power semiconductorcomponent. Furthermore, the pressure device has latching lugs, which are disposed in therecesses and are arranged therein in a form-fitting and/or frictional manner, at least twopoints on the side of the pressure device which faces the substrate.

申请人:Rainer Popp,Markus Gruber

地址:Petersaurach DE,Altdorf DE

国籍:DE,DE

代理机构:The Law Offices of Roger S. Thompson

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