ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION M

专利名称：ELECTRONIC DEVICE, ELECTRONIC DEVICE

FABRICATION METHOD, AND ELECTRONICAPPARATUS

发明人：Hidehiko Kira,Naoaki Nakamura,Sanae IIJIMA申请号：US15368732申请日：20161205

公开号：US20170186718A1公开日：20170629

专利附图：

摘要：An electronic device includes an electronic part including a first substrate havinga group of first terminals over a first front surface and having a concavity in a back

surface, a filler placed in the concavity, and a flat plate placed over the back surface withthe filler therebetween, and further includes a second substrate disposed on the firstfront surface side of the first substrate and having a group of second terminals bondedto the group of first terminals over a second front surface opposite the first frontsurface. The filler and flat plate minimize deformation of the first substrate and variationin the distance between the group of first terminals and the group of second terminalscaused by the deformation of the first substrate, which thereby reduces the occurrenceof a failure in bonding together the group of first terminals and the group of secondterminals.

申请人：FUJITSU LIMITED

地址：Kawasaki-shi JP

国籍：JP

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