专利名称：Automatically-adjusting substrate rinsing
system
发明人：Richard Peng,Kuo-Hsing Teng申请号：US10355770申请日：20030131
公开号：US20040149322A1公开日：20040805
专利附图：
摘要：A new and improved system for rinsing substrates. The substrate-rinsing systemincludes at least one rinsing unit having a nozzle that is angularly and linearly adjustablewith respect to the substrate. A controller may be used to automatically control the
angular and linear positions of the nozzle during the substrate-rinsing procedure inorder to facilitate timely and effective rinsing or cleaning of the substrate.
申请人：TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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