专利名称：Electronic component manufacturing
apparatus, electronic componentmanufacturing method, and electroniccomponent
发明人：Naoko Yamaguchi,Hideo Aoki,Chiaki Takubo申请号：US10866341申请日：20040614
公开号：US20050153249A1公开日：20050714
专利附图：
摘要：There are provided a metal particulate spraying step to spray metal
particulates over a substrate having an insulating pattern formed of thermosetting resin,a heating step to heat and dissolve the resin pattern and fix the metal particulates on theresin pattern, and a metal particulate eliminating step to eliminate metal particulatesattached on the surface of the substrate excluding the resin pattern.
申请人：Naoko Yamaguchi,Hideo Aoki,Chiaki Takubo
地址：Yokohama-shi JP,Yokohama-shi JP,Tokyo JP
国籍：JP,JP,JP
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