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Integration processes for fabricating a conductive

2020-04-01 来源:小奈知识网
专利内容由知识产权出版社提供

专利名称:Integration processes for fabricating a

conductive metal oxide gate ferroelectricmemory transistor

发明人:Tingkai Li,Sheng Teng Hsu,Bruce D. Ulrich申请号:US11215521申请日:20050830公开号:US07329548B2公开日:20080212

专利附图:

摘要:A method of fabricating a conductive metal oxide gate ferroelectric memorytransistor includes forming an oxide layer a substrate and removing the oxide layer in a

gate area; depositing a conductive metal oxide layer on the oxide layer and on theexposed gate area; depositing a titanium layer on the metal oxide layer; patterning andetching the titanium layer and the metal oxide layer to remove the titanium layer and themetal oxide layer from the substrate except in the gate area; depositing, patterning andetching an oxide layer to form a gate trench; depositing and etching a barrier insulatorlayer to form a sidewall barrier in the gate trench; removing the titanium layer from thegate area; depositing, smoothing and annealing a ferroelectric layer in the gate trench;depositing, patterning and etching a top electrode; and completing the conductive metaloxide gate ferroelectric memory transistor.

申请人:Tingkai Li,Sheng Teng Hsu,Bruce D. Ulrich

地址:Vancouver WA US,Camas WA US,Beaverton OR US

国籍:US,US,US

代理机构:Sharp Laboratories of America, Inc.

代理人:Robert D. Varitz

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